SHENZHEN, China - TelAve -- The 25th China International Optoelectronic Exposition (CIOE 2024) took place from September 11-13, 2024, at the Shenzhen International Convention and Exhibition Center, showcasing the scale and influence of the optoelectronic industry. T&S Communications participated in the event, presenting its latest products and technological solutions in optical fiber communications, data centers, and fiber optic sensing.

T&S highlighted several leading optical communication solutions, including 800G high-speed optical modules, AOC, various passive optical components, high-density cabling enclosures, and high-density fiber optic connectivity products and solutions. These innovations are widely applicable in cutting-edge sectors such as large-scale data centers, supercomputing centers, 5G communications, and industrial IoT. Notable attractions included the fiber optic flex circuit series and the 16F SM low-loss MT ferrules, which garnered significant attention from industry professionals.

More on TelAve News

• Beycome Closes $2.5M Seed Round Led by InsurTech Fund
• Tru by Hilton Columbia South Opens to Guests
• Christy Sports donates $56K in new gear to SOS Outreach to help kids hit the slopes
• "BigPirate" Sets Sail: A New Narrative-Driven Social Casino Adventure
• Phinge CEO Ranked #1 Globally by Crunchbase for the Last Week, Will Be in Las Vegas Jan. 4-9, the Week of CES to Discuss Netverse & IPO Coming in 2026

Industry Recognition

On September 11, 2024, the CIOE 25th Anniversary Celebration took place at the Shenzhen International Convention and Exhibition Center. Mr. Cao, the Domestic Market Manager for T&S, represented the company at this prestigious event.

During the celebration, T&S was awarded the "Gold Medal" by the CIOE Organizing Committee in recognition of its long-standing contributions and technological innovations in the industry. This award underscores T&S' more than 15 years of dedicated support and cooperation, affirming its position as a key player in the global optical communications field.

Engaging in Industry Forums

Simultaneously, T&S participated in the 22nd ICCSZ Market and Technology Symposium, themed "Cross-Border Integration, Intelligent Future." The forum focused on AI, ultra-high-speed optical interconnections, and next-generation data transmission technologies, attracting over 1,500 top experts, industry leaders, and professionals from around the globe.

Mr. Jacky Hou, T&S' Assistant Technical Director, was invited as a guest speaker to share insights on the company's latest breakthroughs in high-speed optical interconnection component development and exploring future directions for technological innovation.